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We are looking for a Microwave Packaging Engineer with 5+ years of experience in EM Simulation and Isolation issues with good test skills and manufacturing savvy

The Microwave Packaging Engineer will be responsible for the package design, certification, and release to manufacturing for various RF/Microwave products, including Synthesizers, Oscillators, Converters, Detectors, Mixers, Amplifiers and Hybrid integrated solutions. This will include design simulation for high frequency products, characterization of package materials and manufacturing processes, design validation and required process optimizations.

BSEE with a focus in RF/Microwaves (MSEE or PhD EE preferred) and 5+ years microwave product experience (Microwave packaging experience preferred).

Understanding of IC Packaging including manufacturing processes and package leadframe design. Package characterization and methods.

Proficiency in HFSS for full wave EM simulation.

Knowledge of microwave measurements and familiarity with equipment such as RF Power Meters, RF Signal Sources, Network Analyzer and/or Spectrum Analyzers.

U. S. Citizenship or Permanent Residency Required, Active Security Clearance a plus.

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